Tag Archives: inlay

Processaable isolation layer grid inlay technology used in sub 0.05 micrometer MOS device

Application Number  00129485 Application Date  2000.12.29 Publication Number  1319884 Publication Date  2001.10.31 Priority Information   2000/1/21 US 09/488806   International Classification  H01L21/336   Applicant(s) Name  International Business Machine Corp.   Address     Inventor(s) Name  D.C. Bode;H.I. Hanafei;W.C. Nazils   Patent Agency Code  72001 Patent Agent  chen ji AbstractTechniques to fabricate sub-0.05 mum MOSFET devices… Read More »

Gold coin with single-surface inlay silverring and its making method

Application Number: 00122937Application Date: 2000.08.29Publication Number: 1340421Publication Date: 2002.03.20Priority Information: International: B44C1/26Applicant(s) Name: Shenyang MintAddress: Inventor(s) Name: Dong Jiang;Lin Lanying;Hao JianzhongPatent Agency Code: 21209Patent Agent: liu zhongdaAbstract A commemorative coin with relief pattern on single surface is composed of gold substrate with ring slots and silver rings inlaid in the said ring slots of gold… Read More »

Corrosion technique of anisotropic nitride by inlay corrosion method

Application Number: 00106557Application Date: 2000.04.12Publication Number: 1271871Publication Date: 2000.11.01Priority Information: 1999/4/26 US 09/299,137International: G03F7/004;H01L21/311;H01L21/336;H01L21/762;H01L21/823Applicant(s) Name: IBM Corp.Address: Inventor(s) Name: D. C. Boyd;S. M. Boerns;H. I. HannafyPatent Agency Code: 11038Patent Agent: wang yonggangAbstract A process and etchant gas composition for anisotropically etching a trench in a silicon nitride layer of a multilayer structure and an etchant… Read More »