Tag Archives: interconnection

High-speed ultrasonic signal sampling card for computer structure/peripheral interconnection bus

Application Number: 00113719Application Date: 2000.01.25Publication Number: 1307257Publication Date: 2001.08.08Priority Information: International: G06F1/16Applicant(s) Name: Xiber Polytechnic Univ.Address: Inventor(s) Name: Yang Siqian;Song Weifeng;Wu LuPatent Agency Code: 61204Patent Agent: wang xiankaiAbstract The present invention, high speed ultrasonic signal sample card for universal computer ISA/PCI bus is inserted directly into ISA/PCI bus expanding slot for high speed ultrasonic signal… Read More »

Distributed interconnection network access mode

Application Number: 00119852Application Date: 2000.08.31Publication Number: 1282163Publication Date: 2001.01.31Priority Information: International: H04L12/28;H04M3/42Applicant(s) Name: Shanghai Jiaotong Univ.Address: Inventor(s) Name: Shen Dan;Zhou Zhenzan;Pan QitaoPatent Agency Code: 31201Patent Agent: wang tilinAbstract The distribution type interconnected network access mode is characterized by that firstly, a specific service number is set, user can use local felephone station form to dial… Read More »

Electronic packaged component with high density interconnection layer

Application Number: 00119921Application Date: 2000.06.30Publication Number: 1304174Publication Date: 2001.07.18Priority Information: 1999/7/2 US 09/346,356; 2000/3/31 US 09/540,172International: H01L23/50;H01L21/60Applicant(s) Name: International Business Machine Corp.Address: Inventor(s) Name: Francis.J. Dons;Jr;Donald.S. Farquhar;Elizabeth. FoustPatent Agency Code: 11038Patent Agent: wang yonggangAbstract An electronic package, and method of making the electronic package, is provided. The package includes a semiconductor chip and an multi-layered… Read More »

Method for processing information on international interconnection network

Application Number: 00122953Application Date: 2000.08.29Publication Number: 1282036Publication Date: 2001.01.31Priority Information: International: G06F15/173Applicant(s) Name: Li YanzhiAddress: Inventor(s) Name: Li YanzhiPatent Agency Code: 23101Patent Agent: liu yaAbstract The present invention discloses a method for processing information on international interconnected network, and is characterized by that it utilizes INTERNET server to notify information required to process to user,… Read More »

Method for forming barrier layer used for copper interconnection

Application Number: 00103663Application Date: 2000.03.01Publication Number: 1266279Publication Date: 2000.09.13Priority Information: 1999/3/2 US 09/261,879International: C23C14/00;H01L21/3205;H01L21/768Applicant(s) Name: Motorola, Inc.Address: Inventor(s) Name: Dene J. Dannin;Samo S. Gasia;Braderi P. SmithPatent Agency Code: 11038Patent Agent: wang yonggangAbstract A method for forming an improved copper inlaid interconnect begins by performing an RF preclean operation on the inlaid structure in a chamber.… Read More »

Pin matrix board adopting floating panel mounting interconnection mode

Application Number: 00100963Application Date: 2000.01.12Publication Number: 1263367Publication Date: 2000.08.16Priority Information: 1999/1/12 US 09/228,848International: H01R12/04;H01R12/32Applicant(s) Name: Connector System Technology Co.Address: Inventor(s) Name: Robert W. Hure;Lari G. Sanders;Recks W. KailePatent Agency Code: 11038Patent Agent: zhang jinxiAbstract A floating terminal connector for use with a circuit substrate having a plurality of elongated conductors. A pin retention structure is… Read More »