Tag Archives: laminating

Technology for laminating 6-layer circuit board suitable for high-speed signals and its product

Application Number  00128837 Application Date  2000.09.18 Publication Number  1344132 Publication Date  2002.04.10 Priority Information     International Classification  H05K3/00;H05K3/46;B32B37/00   Applicant(s) Name  Shenda Computer Co Ltd   Address     Inventor(s) Name  Chen Ronggui   Patent Agency Code  31100 Patent Agent  wu rongjun AbstractA 6-layer printed circuit board for high-speed signals features that the first… Read More »

Technology for laminating 6-layer circuit board and its product

Application Number: 00127098Application Date: 2000.09.15Publication Number: 1344130Publication Date: 2002.04.10Priority Information: International: B32B31/00;H05K3/00;H05K3/46Applicant(s) Name: Shenda Computer Co LtdAddress: Inventor(s) Name: Zheng YuqiangPatent Agency Code: 31100Patent Agent: huang yiwenAbstract A 6-layer printed circuit board with 1.6 mm of thickness features that its first, third, fourth and sixth layers are signal layers, its second layer is grounding layer,… Read More »

Technology for laminating 6-layer circuit board and its product

Application Number: 00127096Application Date: 2000.09.15Publication Number: 1344128Publication Date: 2002.04.10Priority Information: International: H05K3/00;H05K3/46;B32B37/00Applicant(s) Name: Shenda Computer Co LtdAddress: Inventor(s) Name: Zheng YuqiangPatent Agency Code: 31100Patent Agent: huang yiwenAbstract A 6-layer printed circuit board with 1 mm of thickness fractures that its second layer is grounding layer, its fifth layer is power supply layer, its first, third,… Read More »

Technology for laminating 6-layer circuit board and its product

Application Number: 00127097Application Date: 2000.09.15Publication Number: 1344129Publication Date: 2002.04.10Priority Information: International: B32B31/00;H05K3/00;H05K3/46Applicant(s) Name: Shenda Computer Co LtdAddress: Inventor(s) Name: Zheng YuqiangPatent Agency Code: 31100Patent Agent: huang yiwenAbstract A 6-layer printed circuit board with 1.2 mm of thickness features that its first, third, fourth and sixth layers are signal layer, the second layer is grounding layer,… Read More »

Multi-functional laminating machine for multi-layer composite fabric

Application Number: 00109109Application Date: 2000.06.08Publication Number: 1287920Publication Date: 2001.03.21Priority Information: 1999/9/14 CN 99244709.7International: B32B31/08;B32B31/12Applicant(s) Name: Science & Tech. Development Depart. of Military Supplies and Equipment Inst., GeAddress: Inventor(s) Name: Zhang Jianchun;Yang Tingxin;Zhang XudongPatent Agency Code: 11100Patent Agent: diao yushengAbstract The present invention relates to multifunctional laminating machine for multilayer fabric and is composed of a… Read More »

Circuit board resin material laminating method

Application Number: 00107331Application Date: 2000.05.12Publication Number: 1323155Publication Date: 2001.11.21Priority Information: International: H05K3/46Applicant(s) Name: Hezheng Science &. Technology Co., Ltd.Address: Inventor(s) Name: Ye YunzhaoPatent Agency Code: 11021Patent Agent: tang baobengAbstract The circuit board resin layer laminating method includes the following steps: image transfer of thin core layer; painting compounded vanish glue homogeneously onto inner layer board… Read More »