Tag Archives: printed

Printed circuit board and display device

Application Number  00129034 Application Date  2000.09.27 Publication Number  1290121 Publication Date  2001.04.04 Priority Information   1999/9/27 JP 271950/1999   International Classification  H05K1/02;H05B33/02   Applicant(s) Name  Sony Corp.   Address     Inventor(s) Name  Matsuda Yoshinari;Suzuki Yoshio;Otake Ryota   Patent Agency Code  11038 Patent Agent  li deshan AbstractThe present invention provides a printed circuit board allowing… Read More »

Copper foil for printed circuit and its manufacture

Application Number  00128973 Application Date  1994.03.29 Publication Number  1295426 Publication Date  2001.05.16 Priority Information   1993/8/31 JP 237181/93; 1993/3/29 JP 91842/93   International Classification  C25D5/00;C25D11/38;H05K1/09;H05K3/00   Applicant(s) Name  Japan Energy Corp.   Address     Inventor(s) Name  Kawasumi Yoshio   Patent Agency Code  31100 Patent Agent  zhang mingyu AbstractA copper foil for printed circuits including… Read More »

Connector for fixing printed circuit between shell and movable actuator

Application Number: 00121515Application Date: 2000.08.09Publication Number: 1284765Publication Date: 2001.02.21Priority Information: 1999/8/17 JP 230376/1999International: H01R12/24Applicant(s) Name: Japan Aviation Electronic Industry Co., Ltd.Address: Inventor(s) Name: Kuto KomeiPatent Agency Code: 11021Patent Agent: rong zhiminAbstract In a connector for use in connecting a FPC having a plurality of pads, a plurality of contacts (16,17) are held by a housing… Read More »

Multi-layer printed circuit board

Application Number: 00121558Application Date: 2000.08.10Publication Number: 1284835Publication Date: 2001.02.21Priority Information: 1999/8/13 JP 229525/1999International: H05K1/00;H05K3/46Applicant(s) Name: NEC Corp.Address: Inventor(s) Name: Toya Hirokazu;Kichita FumioPatent Agency Code: 11219Patent Agent: mu dejunAbstract In order to reduce electromagnetic inductive interference due to power source current, in a multi-layer printed board on which a multiplicity of high-speed and high-frequency circuit elements… Read More »

Technology for making printed convex block on semiconductor carrier

Application Number: 00122885Application Date: 2000.08.31Publication Number: 1340852Publication Date: 2002.03.20Priority Information: International: H01L21/48;H01L21/60;H05K3/00Applicant(s) Name: Huatai Electronic Co LtdAddress: Inventor(s) Name: Xie Wenle;Zhuang Yongcheng;Huang NingPatent Agency Code: 11127Patent Agent: chen yuxuanAbstract A technology for making convex block and semiconductor wafer or substrate includes such steps as using high-stability heat-resisting systhetic adhesive tape to cover the surface of… Read More »

Explosure device for double side printed circuit board

Application Number: 00124136Application Date: 2000.07.07Publication Number: 1280316Publication Date: 2001.01.17Priority Information: 1999/7/8 FR 9908836International: G03F7/20;G03F9/00Applicant(s) Name: Automa-Tech Co.Address: Inventor(s) Name: Giles Hef;Alno LeboxiePatent Agency Code: 11038Patent Agent: huang bijingAbstract The invention relates to an installation for exposing a double-sided printed circuit. The installation comprises a first artwork-support (10) that is fixed, a second artwork (14) that… Read More »

Method and device for making printed pictures

Application Number: 00124645Application Date: 2000.09.26Publication Number: 1289989Publication Date: 2001.04.04Priority Information: 1999/9/27 JP 273185/1999International: G06K15/00;G06F9/445Applicant(s) Name: Ricoh Co., Ltd.Address: Inventor(s) Name: Ikida IkuyoPatent Agency Code: 72002Patent Agent: huang jianfengAbstract The invention relates to method of making printing image and apparatus. When a print driver program is installed in a computer, a space for inserting an annotation… Read More »

Method for preparation of printed IC board

Application Number: 00125299Application Date: 2000.09.21Publication Number: 1285614Publication Date: 2001.02.28Priority Information: International: H01L21/48;H01L21/60;H05K3/00Applicant(s) Name: Shanghai Jiaotong Univ.Address: Inventor(s) Name: Gu Mingyuan;Jin Yanping;Li GeyangPatent Agency Code: 31201Patent Agent: mao cuiyingAbstract The preparation method of printed integrated circuit board is charaterized by using low-expansion high thermal conductivity Al/Sic composite material as radiating base plate, using sputter process to… Read More »

Technological process of making printed circuit board

Application Number: 00117305Application Date: 2000.07.26Publication Number: 1335743Publication Date: 2002.02.13Priority Information: International: H05K3/16;H05K3/46Applicant(s) Name: Zhao YuantaoAddress: Inventor(s) Name: Zhao YuantaoPatent Agency Code: 44209Patent Agent: wang zhimengAbstract The technological process of making printed circuit board includes: coating or adhering one layer of photosensitive material onto one insulating substrate; exposure and development to obtain the negative of the… Read More »

Color printed matter making technology

Application Number: 00125612Application Date: 2000.09.30Publication Number: 1344624Publication Date: 2002.04.17Priority Information: International: B41M5/00;G02B5/23Applicant(s) Name: Shanghai Landao Color Printing Co., Ltd.Address: Inventor(s) Name: Zhu WeilunPatent Agency Code: 31128Patent Agent: yan xindeAbstract The present invention prints color printed matter with color light filter combined by means of multiple color printing technology. Color light filters corresponding to the color… Read More »

Printed flat antenna

Application Number: 00119455Application Date: 2000.07.14Publication Number: 1334617Publication Date: 2002.02.06Priority Information: International: H01Q1/38;H01Q9/16Applicant(s) Name: Fushikang Computer Connector Co., Ltd (Kunshan)Address: Inventor(s) Name: Cai Cinan;Yang Zhongyan;Lin XianzhuPatent Agency Code: 00000Patent Agent: Abstract A plane printing antenna includes printing antenna circuit board, electric dipole unit and coaxial line feeder apparatus. The printing antenna circuit board provides at least… Read More »

Method and mfg liquid crystal display module and single face printed circuit board obtained thereby

Application Number: 00126071Application Date: 2000.08.28Publication Number: 1286410Publication Date: 2001.03.07Priority Information: 1999/8/27 CH 1570/99International: G02F1/133Applicant(s) Name: The Swatch Group Management Services AGAddress: Inventor(s) Name: L. Panteter;C. AbisestierPatent Agency Code: 72001Patent Agent: cui yaobengAbstract The display module (30) includes at least one liquid crystal cell (2) electrically and mechanically connected to a flexible display control printed circuit… Read More »

Printed planar antenna

Application Number: 00119636Application Date: 2000.08.18Publication Number: 1338794Publication Date: 2002.03.06Priority Information: International: H01Q1/24Applicant(s) Name: Foxconn (Kunshan) Computer Connector Co LtdAddress: Inventor(s) Name: Cai CinanPatent Agency Code: 00000Patent Agent: Abstract A printed planar antenna on the electronic device with metallic base is composed of a printed circuit board, the first rectangular waved antenna component on the first… Read More »

Printed circuit board and mask of screen printing such printed circuit bard

Application Number: 00120938Application Date: 2000.08.03Publication Number: 1283954Publication Date: 2001.02.14Priority Information: 1999/8/9 KR 32571/1999International: H05K3/34Applicant(s) Name: Samsung Electronics Co., Ltd.Address: Inventor(s) Name: Kim Kaeng-I;Lee Gon-Yong;Chong Gwang-SooPatent Agency Code: 11219Patent Agent: xie linaAbstract The invention provides a printed circuit board and a pad apparatus for printing the PCB. In PCB, the solder deposit includes first and second… Read More »

Printed circuit board forming and hole drilling process

Application Number: 00121225Application Date: 2000.08.07Publication Number: 1337845Publication Date: 2002.02.27Priority Information: International: H05K3/46Applicant(s) Name: Lianxing Science &. Technology Co., Ltd.Address: Inventor(s) Name: Dong WenshanPatent Agency Code: 11127Patent Agent: liu lingdiAbstract The invention relates to forming of printed circuit board and manufacturing the target bore process. The invention includes following process. The target bore is recognized and… Read More »

Connector for printed wiring board

Application Number: 00109675Application Date: 2000.06.20Publication Number: 1282124Publication Date: 2001.01.31Priority Information: 1999/7/26 JP 210229/1999International: H01R13/658;H01R12/36Applicant(s) Name: Nippon Press Terminal Manufacture Co., Ltd.Address: Inventor(s) Name: Kuroda Keiji;Aramoto KiyoshiPatent Agency Code: 11021Patent Agent: huang yongkuiAbstract The present invention provides a connector (1) for printed circuit board, which comprises a connector body (8) having an insertion space (5) for… Read More »

Insulative material for printed circuit board

Application Number: 00109572Application Date: 2000.07.05Publication Number: 1315734Publication Date: 2001.10.03Priority Information: 2000/3/24 JP 083554/2000International: H01B3/40Applicant(s) Name: Matsushita Electric Works, Ltd.Address: Inventor(s) Name: Saifuji Eiichiro;Shinotani Kenichi;Furumori HiyotakaPatent Agency Code: 72002Patent Agent: cheng weiAbstract An insulating material for printed wiring boards characterized by comprising: a silane modified resin composition containing an alkoxy-group containing silane modified resin obtained by… Read More »

Hot composition process of woven color printed plastic bag

Application Number: 00108852Application Date: 2000.05.07Publication Number: 1277105Publication Date: 2000.12.20Priority Information: International: B29C65/02;B32B7/10;B32B27/08Applicant(s) Name: Kaida Packing Machine Works,Pingyang CountyAddress: Inventor(s) Name: Huang Meichang;Cheng ChangzongPatent Agency Code: 00000Patent Agent: Abstract The present invention relates to the automatic production process of high-grade packing bag, and the hot composition process completed in a special composition machine includes the steps… Read More »

Printed anti-skid plastic floor making process

Application Number: 00108846Application Date: 2000.05.05Publication Number: 1322888Publication Date: 2001.11.21Priority Information: International: E04F15/16Applicant(s) Name: Chen JihuaAddress: Inventor(s) Name: Chen JihuaPatent Agency Code: 00000Patent Agent: Abstract Printed anti-skid plastic floor is made through spreading plastic paste, covering uncured plastic layer by using soft template with embossed pattern and painted demolding agent, curing, and uncovering the template. The… Read More »

Edge and connector for printed circuit board

Application Number: 00108738Application Date: 2000.05.31Publication Number: 1275825Publication Date: 2000.12.06Priority Information: 1999/6/1 US 09/323317International: H01R12/18;H01R12/22;H01R12/32Applicant(s) Name: Molex Inc.Address: Inventor(s) Name: K. M. Zhang;J. L. Maglas;R. A. NeirsenPatent Agency Code: 72001Patent Agent: zheng jianhuiAbstract An edge card electrical connector is adapted for receiving an edge of a printed circuit board having contact pads on at least one… Read More »

Mat under printed circuit board, and its processing art

Application Number: 00108481Application Date: 2000.06.09Publication Number: 1277917Publication Date: 2000.12.27Priority Information: International: B32B15/14;H05K1/03Applicant(s) Name: Zhao XishuiAddress: Inventor(s) Name: Zhao XishuiPatent Agency Code: 13100Patent Agent: wang yuxiangAbstract The present invention relates to an improvement of the structural design and mfg. technology of printed circuit board backing plate, its structure adopts medium or high density core plate and… Read More »

Printed circuit board and its mfg. method

Application Number: 00107571Application Date: 2000.05.16Publication Number: 1274256Publication Date: 2000.11.22Priority Information: 1999/5/18 KR 17733/99International: H05K3/42;H05K3/46Applicant(s) Name: Samsung Electronics Co., Ltd.Address: Inventor(s) Name: Park Gon-Yang;Kim Hong-Jik;Lee Yong-samPatent Agency Code: 11219Patent Agent: xie linaAbstract A printed circuit board and a manufacturing method therefor are disclosed. The method for manufacturing the printed circuit board includes the following steps. A… Read More »

Installing method of high-density coaxial junction on printed circuit board

Application Number: 00107526Application Date: 2000.05.17Publication Number: 1269697Publication Date: 2000.10.11Priority Information: International: H05K3/00;H05K3/30Applicant(s) Name: Runguangtaili Science & Technology Development Co., Ltd., BeijingAddress: Inventor(s) Name: Yan Jun;Wang QinggangPatent Agency Code: 00000Patent Agent: Abstract The mounting method of high density coaxial adapter connectors on the printed circuit board is characterized by that the connectors to be mounted are… Read More »

Electric connector for flexible printed circuit board

Application Number: 00107225Application Date: 2000.04.28Publication Number: 1272702Publication Date: 2000.11.08Priority Information: 1999/4/30 JP 124566/1999International: H01R12/24;H01R12/26Applicant(s) Name: Nippon Press Terminal Manufacture Co., Ltd.Address: Inventor(s) Name: Miura Ichito;Miyao Taiichiro;Uchida ShinjiPatent Agency Code: 11021Patent Agent: huang yongkuiAbstract A connector includes a cover adapted to openably close an opening of a housing, and a locking mechanism for locking the cover… Read More »

Electric connector for flexible printed circuit board

Application Number: 00107224Application Date: 2000.04.28Publication Number: 1272701Publication Date: 2000.11.08Priority Information: 1999/4/30 JP 124565/1999International: H01R12/24;H01R12/26Applicant(s) Name: Nippon Press Terminal Manufacture Co., Ltd.Address: Inventor(s) Name: Miura Ichito;Miyao Taiichiro;Uchida ShinjiPatent Agency Code: 11021Patent Agent: huang yongkuiAbstract An electrical connector for flexible printed board includes a housing with an opening, and a cover rotatable about a pivotal axis for… Read More »

Interlamellar insulation adhesive using for multilayer printed circuit board

Application Number: 00106883Application Date: 2000.03.10Publication Number: 1267696Publication Date: 2000.09.27Priority Information: 1999/3/11 JP 064251/1999International: C09J163/00;H05K3/46Applicant(s) Name: Sumitomo Bakelite Co., Ltd.Address: Inventor(s) Name: Omiyatani Juro;Uesaka Masao;Arai MasatakaPatent Agency Code: 11038Patent Agent: ren zonghuaAbstract In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance… Read More »

Device for electrically connecting coaxial line on printed circuit board

Application Number: 00106259Application Date: 2000.05.19Publication Number: 1274967Publication Date: 2000.11.29Priority Information: 1999/5/20 FR 9906400International: H01R12/18;H01R12/32Applicant(s) Name: RadiarAddress: Inventor(s) Name: Jean Marc BaffertPatent Agency Code: 72003Patent Agent: li qiangAbstract The invention relates to a device for electrically connecting a coaxial line to a printed circuit card having at least two conductor tracks each extending to an edge… Read More »

Printed circuit board

Application Number: 00106091Application Date: 2000.04.20Publication Number: 1271248Publication Date: 2000.10.25Priority Information: 1999/4/21 JP 114201/1999International: H05K1/00Applicant(s) Name: NEC Corp.Address: Inventor(s) Name: Suzuki MitsuoPatent Agency Code: 11021Patent Agent: liu xiaofengAbstract In a printed wiring board, slotted portions are provided in a grounding layer so as to be positioned under communication lines print-wired on a printed wiring board. Capacitors… Read More »

Method for forming through holes on substrate of printed circuit

Application Number: 00105760Application Date: 2000.04.05Publication Number: 1316874Publication Date: 2001.10.10Priority Information: International: H05K3/40Applicant(s) Name: Lin HongmingAddress: Inventor(s) Name: Lin Hongming;Ma Chongren;Zhong CunchengPatent Agency Code: 11021Patent Agent: tang baobengAbstract A technology for forming through holes on substrate of PCB includes such steps as generating several ring recesses on one surface of said substrate, which do not pass… Read More »

Insualtion resin composition for multi-layer printed circuit board

Application Number: 00105375Application Date: 2000.03.31Publication Number: 1269693Publication Date: 2000.10.11Priority Information: 1999/4/1 JP 95470/99International: H01B3/30;H05K1/00Applicant(s) Name: Ajinomoto Co., Ltd.Address: Inventor(s) Name: Seikiho Akiry;Ito Takafumi;Matsutsuki AidejiPatent Agency Code: 72001Patent Agent: tai gongAbstract Herein is disclosed an insulating resin composition for a multilayer printed-wiring board, comprising two or more kinds of resins which are different in etching rate… Read More »