Tag Archives: resin

Resin molding method and device to seal electronic element

Application Number: 00124006Application Date: 1994.07.22Publication Number: 1308368Publication Date: 2001.08.15Priority Information: 1993/7/22 JP 202689/93; 1993/7/22 JP 202690/93; 1993/12/14 JP 343141/93International: H01L21/56Applicant(s) Name: Towa K.K.Address: Inventor(s) Name: Bando HirohikoPatent Agency Code: 31100Patent Agent: li jialinAbstract A method and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded… Read More »

Air-dried unsaturated polyester resin for putty

Application Number: 00112982Application Date: 2000.05.29Publication Number: 1325914Publication Date: 2001.12.12Priority Information: International: C08G63/183;C09D5/34Applicant(s) Name: Wanhe Co Ltd, Guilin CityAddress: Inventor(s) Name: Xiang Yansheng;Shen Cheng;Sun QuanPatent Agency Code: 45107Patent Agent: feng tianchiAbstract An air-dried unsaturated polyester resin for putty is prepared from phenylanhydride, cis-anhydride, diglycol, glycerin, isooctanoic acid and styrene through sequentially adding them to reactor while… Read More »

Blowing method for blowing synthetic resin into furnace

Application Number: 00118881Application Date: 1997.03.28Publication Number: 1280197Publication Date: 2001.01.17Priority Information: 1997/2/12 JP 027581/1997; 1996/9/13 JP 243921/1996; 1996/9/13 JP 243923/1996; 1996/9/13 JP 243924/1996; 1996/9/13 JP 265139/1996; 1996/12/17 JP 337023/1996International: C21B5/00Applicant(s) Name: Nippon Kokan K.K.Address: Inventor(s) Name: Nakamura Hiromi;Okawa Uchihiko;Fujii MasuhiroPatent Agency Code: 11038Patent Agent: ma jiangliAbstract A method for blowing a synthetic resin material into a… Read More »

Polyethylene resin composition used for rotational moulding and rotational moulded product made with said composition

Application Number: 00120777Application Date: 2000.07.14Publication Number: 1281003Publication Date: 2001.01.24Priority Information: 1999/7/16 JP P11-202678; 2000/6/23 JP P12-194925International: C08L23/04Applicant(s) Name: Mitsui Chemicals, Inc.Address: Inventor(s) Name: Tsujiyo Ichiro;Tanaka MutsukoPatent Agency Code: 11243Patent Agent: cang jianmengAbstract The polyethylene resin composition for rotational molding according to the invention is a composition comprising an ethylene-alpha-olefin copolymer (A) and an ethylene-alpha-olefin copolymer… Read More »

Process and equipment for spraying polyether etherone resin on surface of metallic product

Application Number: 00124753Application Date: 2000.09.15Publication Number: 1343534Publication Date: 2002.04.10Priority Information: International: B05D1/02;B05D3/00;B05D7/16Applicant(s) Name: Cai GuohuaAddress: Inventor(s) Name: Cai GuohuaPatent Agency Code: 11241Patent Agent: xia yanbengAbstract A method for spraying polyether etherone resin on the surface of metallic product includes removing rust from the said surface, coating an aluminium layer, heating workpiece to 420-450 deg.C, and… Read More »

Polyacrylic acid graft copolymer workable high hydroscopicity resin

Application Number: 00116231Application Date: 2000.05.30Publication Number: 1272505Publication Date: 2000.11.08Priority Information: International: C08F2/06;C08F257/02Applicant(s) Name: Shanghai Jiaotong Univ.Address: Inventor(s) Name: Wang Guojian;Yan DeyuePatent Agency Code: 31201Patent Agent: mao cuiyingAbstract The present invention relates to a polyacrylic graft copolymerized workable high-hydroscopicity resin, and is characterized by that it uses p(o)-halomethyl styrene and styrene as monomer, and uses 2,2'-dipyridyl/cuprous… Read More »

Manufacturing method of lead-wire frame and resin sealing type semiconductor device

Application Number: 00122860Application Date: 2000.08.30Publication Number: 1291789Publication Date: 2001.04.18Priority Information: 1999/9/1 JP 247530/1999International: H01L21/50;H01L23/495;H01L23/50Applicant(s) Name: Matsushita Electric Corp.Address: Inventor(s) Name: Kosuo Kyoiki;Adachi OsamuPatent Agency Code: 11021Patent Agent: wang huiminAbstract In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion.… Read More »

Process for preparing polyamide resin used for alcohol-soluble ink

Application Number: 00126683Application Date: 2000.11.14Publication Number: 1353128Publication Date: 2002.06.12Priority Information: International: C08G69/26;C09D11/10Applicant(s) Name: Yueyang Petro-Chemical General Plant, Baling Petro-Chemical CoAddress: Inventor(s) Name: Chen Ziming;Peng Zhihan;Zhou XuerongPatent Agency Code: 00000Patent Agent: Abstract A process for preparing polyamide resin used for alcohol-soluble ink features that in its reaction reaction system, beside dimer acid and ethanediamine the metaphenyl… Read More »

Preparation method of high water absorption water-retaining resin

Application Number: 00117783Application Date: 2000.06.20Publication Number: 1329097Publication Date: 2002.01.02Priority Information: International: C08F120/06Applicant(s) Name: Duan XiliAddress: Inventor(s) Name: Duan Xili;Li JiePatent Agency Code: 00000Patent Agent: Abstract A preparation method of high-water absorption water retenitivity resin includes the following steps: using alkali liquor to neutralize acrylic acid, regulating pH value to 6-8, before neutralization or in the… Read More »

Ethylene-ethenol copolymer constituted resin composition with good adhesiveness between layers

Application Number: 00124056Application Date: 2000.07.07Publication Number: 1281004Publication Date: 2001.01.24Priority Information: 1999/7/7 JP 192844/99; 1999/9/7 JP 253516/99International: C08L23/08;C08L29/04Applicant(s) Name: Kuraray Co., Ltd.Address: Inventor(s) Name: Shintome Hiroyuki;Ino NaokiyoPatent Agency Code: 72001Patent Agent: wei jinxiAbstract Disclosed are a resin composition comprising an ethylene-vinyl alcohol copolymer and a multi-layered structure comprising the resin composition. The resin composition has extremely… Read More »

Preparation of cyclohexannoe-lower aldehyde epoxy resin

Application Number: 00113383Application Date: 2000.04.20Publication Number: 1269375Publication Date: 2000.10.11Priority Information: International: C08G81/00Applicant(s) Name: Yueyang Petrochemical Plant, Baling Petrochemical Corp.Address: Inventor(s) Name: Yu Weixun;Peng Xiaoping;Mao ShunliPatent Agency Code: 43103Patent Agent: wang mengshuAbstract The present invention discloses a preparation method for cyclohexanone low-grade aldehydes epoxy resin which uses cyclohexanone low-grade aldehyde resin and epoxy resin as raw… Read More »

Aromatic polysulphone resin composition and its moulded product

Application Number: 00118884Application Date: 2000.06.22Publication Number: 1290722Publication Date: 2001.04.11Priority Information: 1999/6/24 JP 178269/99; 1999/8/25 JP 238543/99International: C08L67/03;C08L81/06Applicant(s) Name: Sumitomo Chemical Co., Ltd.Address: Inventor(s) Name: Arai Noriyuki;Eino AkiPatent Agency Code: 72001Patent Agent: liu yuanjinAbstract The invention provides an aromatic polysulfone resin composition comprising 5 to 50 parts by weight of a liquid crystal polyester resin having… Read More »

Polyolefin resin composition

Application Number: 00120780Application Date: 2000.07.14Publication Number: 1281002Publication Date: 2001.01.24Priority Information: 1999/7/14 JP P11-200624; 2000/6/19 JP P12-182803International: C08L23/00;C08K5/51Applicant(s) Name: Mitsui Chemicals, Inc.Address: Inventor(s) Name: Hamada Naoshi;Hirakawa Sada;Yamamoto AkihikoPatent Agency Code: 11243Patent Agent: cang jianmengAbstract A polyolefin resin composition comprising (A) an ethylene-based polyolefin having a density of 0.865 to 0.980 g/cm3 and MFR of 0.01 to… Read More »

Semiconductor device packaged by resin

Application Number: 00124859Application Date: 2000.09.15Publication Number: 1289147Publication Date: 2001.03.28Priority Information: 2000/6/20 JP 184151/2000; 1999/9/16 JP 261959/1999International: H01L21/60;H01L23/28;H01L23/48Applicant(s) Name: NEC Corp.Address: Inventor(s) Name: Nunose Masahiko;Takisawa Tomoko;Honta KoichiPatent Agency Code: 11219Patent Agent: mu dejunAbstract A method for forming a mold-encapsulated semiconductor device includes the steps of mounting a semiconductor chip on a metallic plate having a metallic… Read More »

Polymethylacrylic acid multi-arm start-like workable high hydroscopicity resin

Application Number: 00116232Application Date: 2000.05.30Publication Number: 1272506Publication Date: 2000.11.08Priority Information: International: C08F2/06;C08F257/02Applicant(s) Name: Shanghai Jiaotong Univ.Address: Inventor(s) Name: Wang Guojian;Yan DeyuePatent Agency Code: 31201Patent Agent: mao cuiyingAbstract The present invention relates to a polymethacrylic multi-arm star-shaped workable high-hydroscopicity resin, and is characterized by that it uses p(o)-halomethyl styrene as monomer, and uses 2,2'-dipyridyl/cuprous chloride/1-chlorphenylethane (bpy/CuCl/1-PECl)… Read More »

Epoxy resin composite containing compound inorganic stuffing

Application Number: 00122861Application Date: 2000.08.30Publication Number: 1288914Publication Date: 2001.03.28Priority Information: International: C08K3/00;C08L63/00Applicant(s) Name: Inst. of Chemistry, Chinese Academy of ScienceAddress: Inventor(s) Name: Liu Xin;Zhou Wei;Li GangPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract The epoxy resin composite includes (weight portion) 100 portions of epoxy resin, 20-80 portions of solidifying agent phenolic resin, 1-5 portions of solidification… Read More »

Solidifying agent of epoxy resin

Application Number: 00126748Application Date: 2000.12.21Publication Number: 1298913Publication Date: 2001.06.13Priority Information: International: C08K5/17;C09J163/00Applicant(s) Name: Li ZijianAddress: Inventor(s) Name: Li ZijianPatent Agency Code: 43108Patent Agent: zhang hanqinAbstract An epoxide resin curing agent is made up by compounding phenol, formaldehyde, ethylenediamine, para tert butyl phenol, n-butanol glycidylaether, polypropanediolglycidyl ether etc as raw material ingredients in a certain proportion.… Read More »

Thermoplastic resin composition contg. hard dispersion phase

Application Number: 00117959Application Date: 2000.04.15Publication Number: 1276392Publication Date: 2000.12.13Priority Information: 1999/4/15 FR 99/04722International: C08L23/00;C08L27/12;C08L67/00;C08L77/00Applicant(s) Name: Elf Atochem S. A.Address: Inventor(s) Name: D. Bertain;A. Bouilhou;L. TeserPatent Agency Code: 72001Patent Agent: liu yuanjinAbstract The invention relates to a thermoplastic composition comprising: a matrix-forming thermoplastic polymer (M), rigid nodules obtained by radical polymerization, and optionally an impact modifier.… Read More »

Thermosetting resin composition used in ink stocking method

Application Number: 00124118Application Date: 2000.06.30Publication Number: 1281008Publication Date: 2001.01.24Priority Information: 1999/7/2 JP 188978/99International: C08L63/00;C08L81/06;H01B3/40Applicant(s) Name: Sumitomo Chemical Co., Ltd.Address: Inventor(s) Name: Hayashi Toshiaki;Nakashima Nobuko;Saito NoriakiPatent Agency Code: 72001Patent Agent: tai gongAbstract Provided are a thermosetting resin composition for build-up method which gives a cured product excellent in heat resistance, an insulating material for build-up method… Read More »

Process for preparing long-chain unsaturated carboxylic acid graft thermoplastic resin

Application Number: 00114937Application Date: 2000.03.16Publication Number: 1263898Publication Date: 2000.08.23Priority Information: International: C08F255/02;C08F279/04Applicant(s) Name: Shanghai Jiaotong Univ.Address: Inventor(s) Name: Huang Hua;Liu Niancai;Zhou ZhengfaPatent Agency Code: 31201Patent Agent: luo yinpeiAbstract A process for preparing the thermoplastic resin grafted by long-chain unsaturated carboxlic acid features that in the reactor and/or solvent the graft reaction between long-chain unsaturated carboxylic… Read More »

Resin composition and cable connector

Application Number: 00118978Application Date: 2000.07.21Publication Number: 1291623Publication Date: 2001.04.18Priority Information: 1999/7/21 GB 9917119.1International: C08K7/16;C08L33/08;H02G15/08Applicant(s) Name: BICC British Universal Cable Co., Ltd.Address: Inventor(s) Name: P.B. WilliamsonPatent Agency Code: 11038Patent Agent: liu jinhuiAbstract A resin composition primarily suitable for filling electric cable joints for service at ''low'' voltages (up to around 36kV) comprises a resin base consisting… Read More »

Flexible resin composition and its use

Application Number: 00120805Application Date: 2000.07.27Publication Number: 1281871Publication Date: 2001.01.31Priority Information: 1999/7/27 JP P11-211877International: C08J5/00;C08L23/12;C08L23/16Applicant(s) Name: Mitsui Chemicals Inc.Address: Inventor(s) Name: Tanaka Yasuo;Yasaka NaotoPatent Agency Code: 11243Patent Agent: cang jianmengAbstract The flexible resin composition of the invention is prepared in the presence of a metallocene catalyst and comprises an ethylene/alpha-olefin random copolymer (A) and a polypropylene… Read More »

Low-poison urea-formaldehyde resin adhesive and its preparing process

Application Number: 00124884Application Date: 2000.09.21Publication Number: 1291632Publication Date: 2001.04.18Priority Information: International: C09J103/20;C09J161/06Applicant(s) Name: He WeipingAddress: Inventor(s) Name: Sun Xiaomo;Feng HaiqiangPatent Agency Code: 00000Patent Agent: Abstract A low-poison urea-formaldehyde resin adhesive is prepared from urea, formaldehyde, cyanuramide, phenolic resin and oxidized starch, and features low content of free formaldehyde, resulting in low environmental pollution.

Polymethylacrylic acid graft copolymer workable high hydroscopicity resin

Application Number: 00116233Application Date: 2000.05.30Publication Number: 1272507Publication Date: 2000.11.08Priority Information: International: C08F2/06;C08F257/02Applicant(s) Name: Shanghai Jiaotong Univ.Address: Inventor(s) Name: Wang Guojian;Yan DeyuePatent Agency Code: 31201Patent Agent: mao cuiyingAbstract The present invention relates to a polymethacrylic graft copolymerized coorkable high-hydroscopicity resin, and is characterized by that it uses p(o)-halomethyl styrene and styrene as monomer, and uses 2,2'-dipyridyl/cuprous… Read More »

Epoxy resin composite containing organosilicon modifier

Application Number: 00122862Application Date: 2000.08.30Publication Number: 1288915Publication Date: 2001.03.28Priority Information: International: C08K5/54;C08L63/00Applicant(s) Name: Inst. of Chemistry, Chinese Academy of SciencesAddress: Inventor(s) Name: Zhou Wei;Liu Xin;Li GangPatent Agency Code: 11021Patent Agent: hu jiaoyuAbstract The epoxy resin composite includes epoxy resin, solidifying agent phenolic resin, solidification accelerating agent, inorganic filler and organic silicon modifying agent, in which… Read More »

Lead-frame and resin sealing member with same, and photoelectronic device

Application Number: 00127021Application Date: 2000.09.11Publication Number: 1288261Publication Date: 2001.03.21Priority Information: 1999/9/10 JP 257050/99International: H01L23/495;H01L23/28Applicant(s) Name: Matsushita Electric Corp.Address: Inventor(s) Name: Nakanishi Hideyuki;Ishima Shinichi;Kichikawa AkioPatent Agency Code: 72001Patent Agent: jiang fuhouAbstract A lead frame is possessed of a die pad, equipped with a thick-walled die pad body and a middle thick-walled die pad peripheral part provided… Read More »

Citrin ester compound, plasticizer and thermoplastic resin composition for thermoplastic resin produced therewith

Application Number: 00118024Application Date: 2000.05.31Publication Number: 1277186Publication Date: 2000.12.20Priority Information: 1999/5/31 JP 152958/99; 2000/1/28 JP 20655/00; 1999/11/1 JP 310993/99; 1999/11/1 JP 311059/99; 2000/2/25 JP 49362/00International: C07C69/704;C08K5/10;C08L1/12;C08L25/06;C08L27/06Applicant(s) Name: Dassel Chemical Industry Co., Ltd.Address: Inventor(s) Name: Nakata Koji;Onishi YasuhiroshiPatent Agency Code: 31100Patent Agent: chen jianhuaAbstract In the first aspect of the invention, there are provided a citrate… Read More »

Resin composition used for optical fiber loose manifold, optical fiber loose manifold and making method thereof

Application Number: 00124119Application Date: 2000.06.23Publication Number: 1282764Publication Date: 2001.02.07Priority Information: 1999/6/24 JP 178680/99International: B29D23/00;C08L67/03Applicant(s) Name: Teijin Ltd.Address: Inventor(s) Name: Ono Shinto;Sugie Kiyoshi;Sasaki ShinichiPatent Agency Code: 72001Patent Agent: tai gongAbstract A resin composition for optical fiber loose tubes contains (A) 100 parts by weight of polybutylene terephthalate having a terminal carboxyl group concentration of 10 eq/ton… Read More »

Polyetherimide modified epoxy resin

Application Number: 00114942Application Date: 2000.03.14Publication Number: 1263909Publication Date: 2000.08.23Priority Information: International: C08L63/00;C08L79/08Applicant(s) Name: Fudan Univ.Address: Inventor(s) Name: Li Shanjun;Cui Jun;Tang XiaolinPatent Agency Code: 31200Patent Agent: yao jingfangAbstract A process for preparing the polyetherimide modified epoxy resin by mixing method featurs that 5-45 Phr of polyetherimide and 20-60 Phr of solidifying agent are added to epoxy… Read More »

Biologically degradable fibre level resin composition and its producing method

Application Number: 00119372Application Date: 2000.07.13Publication Number: 1280146Publication Date: 2001.01.17Priority Information: International: B29C47/38;C08L23/12Applicant(s) Name: Danhai Co., Ltd., TianjinAddress: Inventor(s) Name: Liu Jiafan;Quan ShipuPatent Agency Code: 12101Patent Agent: tian shuzhenAbstract This invention is concerned with the process for producing biologically degrabable fiber level resin and its composition comprising denatured starch 15-25 wt%, titanate coupling agent 0.1-3.0 wt%,… Read More »