Tag Archives: semiconductor

Semiconductor device and semoconductor base board and their manufacture

Application Number  00129584 Application Date  2000.10.08 Publication Number  1295365 Publication Date  2001.05.16 Priority Information   1999/10/6 JP 285582/1999   International Classification  H01S5/00;H01L21/00   Applicant(s) Name  Matsushita Electric Corp.   Address     Inventor(s) Name  Nakamura Naotsugu;Ishida Masako;Orita Kenko   Patent Agency Code  11021 Patent Agent  wang huimin AbstractA semiconductor device is provided to reduce defects.… Read More »

Buried metal contact structure and manufacture of semiconductor FET device

Application Number  00129498 Application Date  2000.12.29 Publication Number  1308378 Publication Date  2001.08.15 Priority Information   2000/1/12 US 09/481914   International Classification  H01L29/78;H01L27/12;H01L21/336   Applicant(s) Name  IBM Corp.   Address     Inventor(s) Name  Feng Jiaxin   Patent Agency Code  72001 Patent Agent  chen ji AbstractAn SOI MOSFET device is described having a body region positioned… Read More »

Semiconductor device

Application Number  00129300 Application Date  2000.10.08 Publication Number  1291066 Publication Date  2001.04.11 Priority Information   1999/10/4 JP 282542/99   International Classification  H01L27/20;H04R19/04   Applicant(s) Name  Sanyo Electric Co., Ltd.   Address     Inventor(s) Name  Okawa Shigeaki;Okota Toshiyuki;Obayashi Yoshiaki   Patent Agency Code  72001 Patent Agent  yang kai AbstractThe invention prevents malfunction of a circuit… Read More »

Semiconductor device

Application Number  00129299 Application Date  2000.10.08 Publication Number  1291065 Publication Date  2001.04.11 Priority Information   1999/10/4 JP 282544/99   International Classification  H01L27/20;H04R19/04   Applicant(s) Name  Sanyo Electric Co., Ltd.   Address     Inventor(s) Name  Okawa Shigeaki;Okota Toshiyuki;Obayashi Yoshiaki   Patent Agency Code  72001 Patent Agent  yang kai AbstractThe invention prevents malfunction of an electronic… Read More »

Exposure mask, its manufacturing method and making method of semiconductor device using same

Application Number  00129284 Application Date  2000.09.30 Publication Number  1293449 Publication Date  2001.05.02 Priority Information   1999/9/30 JP 280499/1999   International Classification  G03F1/16;H01L21/027   Applicant(s) Name  K.K. Toshiba   Address     Inventor(s) Name  Esaki Mizusen   Patent Agency Code  11038 Patent Agent  wang sibeng AbstractA mask of certain type has a transparent base and a… Read More »

Epoxy resin composition and semiconductor device

Application Number  00129271 Application Date  2000.09.30 Publication Number  1345896 Publication Date  2002.04.24 Priority Information     International Classification  C08L63/00;H01L23/28   Applicant(s) Name  Sumitomo Bakelite Co., Ltd.   Address     Inventor(s) Name  Ota Ken   Patent Agency Code  11038 Patent Agent  chen cuan AbstractThe epoxy resin composition with excellent forming property, fire-resisting property, low water… Read More »

Epoxy resin composition and semiconductor device

Application Number  00129270 Application Date  2000.09.30 Publication Number  1346150 Publication Date  2002.04.24 Priority Information     International Classification  C08L63/00;H01L23/29   Applicant(s) Name  Sumitomo Bakelite Co., Ltd.   Address     Inventor(s) Name  Kaiga Fumihiro   Patent Agency Code  11038 Patent Agent  chen cuan AbstractThe present invention discloses to an epoxy resin composition containing no bromide… Read More »

Manufacture of semiconductor device and equipment therefor

Application Number  00129032 Application Date  2000.09.27 Publication Number  1290034 Publication Date  2001.04.04 Priority Information   1999/9/27 JP 271803/1999   International Classification  H01L21/66;H01L21/68   Applicant(s) Name  Hitachi Ltd.   Address     Inventor(s) Name  Kawano Tatsuji;Kiyomizu Koya;Kanamaru Masatoshi   Patent Agency Code  11038 Patent Agent  du rixin AbstractA packaging device for holding thereon a plurality of… Read More »

Semiconductor device and its manufacture

Application Number  00129021 Application Date  2000.09.25 Publication Number  1307364 Publication Date  2001.08.08 Priority Information   2000/1/28 JP 20309/00   International Classification  H01L23/52;H01L21/768;H01L21/31;H01L21/28   Applicant(s) Name  Mitsubishi Electric Corp.   Address     Inventor(s) Name  Fujimoto Kenmasa;Harada Shige;Yamashita Takaji   Patent Agency Code  72001 Patent Agent  yang kai AbstractThe invention provides a semiconductor device having high… Read More »

Card-shape semiconductor memory and its manufacturing, operating and setting method

Application Number  00128987 Application Date  2000.08.05 Publication Number  1284725 Publication Date  2001.02.21 Priority Information   1999/8/5 JP 222351/99   International Classification  G11C11/34;G11C16/00   Applicant(s) Name  Sony Corp.   Address     Inventor(s) Name  Inomura Shigeshi   Patent Agency Code  72001 Patent Agent  fu kang AbstractA CPU and an enciphering circuit are provided in a memory… Read More »

SOI semiconductor integrated circuit for eliminating floater effect and mfg. method thereof

Application Number  00128891 Application Date  2000.09.28 Publication Number  1300102 Publication Date  2001.06.20 Priority Information   1999/10/25 US 60/161,479   International Classification  H01L27/12;H01L21/84   Applicant(s) Name  Samsung Electronics Co. Ltd.   Address     Inventor(s) Name  Kim Yong-Ul;Kim Byong-Sun;Kang Hvi-Seung   Patent Agency Code  11105 Patent Agent  tao fengbei AbstractA silicon-on-insulator (SOI) integrated circuit and a… Read More »

Semiconductor device and manufacture thereof

Application Number  00128864 Application Date  2000.09.26 Publication Number  1290039 Publication Date  2001.04.04 Priority Information   1999/9/27 JP 272583/99   International Classification  H01L21/00;H01L27/12   Applicant(s) Name  Semiconductor Energy Laboratory Co., Ltd.   Address     Inventor(s) Name  Shibata Hiroshi;Isobe Atsuo   Patent Agency Code  72001 Patent Agent  wang yue Abstractprovided is a liquid crystal display device… Read More »

Terminal designs of wavelength-division multiplexing system with online semiconductor optical amplifier

Application Number  00128824 Application Date  2000.09.22 Publication Number  1290083 Publication Date  2001.04.04 Priority Information   1999/9/24 US 09/405,679   International Classification  H04J14/02   Applicant(s) Name  Lucent Technologies Inc.   Address     Inventor(s) Name  S. Benagi;Sun Yan;B.R. Itchenbom   Patent Agency Code  11038 Patent Agent  jiang shixun AbstractSemi-conductor amplifiers may be used in an optical… Read More »

Semiconductor apparatus

Application Number  00128823 Application Date  2000.09.22 Publication Number  1289126 Publication Date  2001.03.28 Priority Information   1999/9/22 JP 269520/1999   International Classification  G11C11/40   Applicant(s) Name  Toshiba K.K.   Address     Inventor(s) Name  Otsuka Noburo;Kameta Osamu   Patent Agency Code  11038 Patent Agent  wang sibeng AbstractA semiconductor device has an output buffer circuit having transistors… Read More »

Semiconductor device, semiconductor electret capacitor microphone and mfg. method thereof

Application Number  00128754 Application Date  2000.09.15 Publication Number  1289220 Publication Date  2001.03.28 Priority Information   1999/9/16 JP 261374/99   International Classification  H04R19/04;H04R31/00   Applicant(s) Name  Sanyo Electric Co., Ltd.   Address     Inventor(s) Name  Okawa Shigeaki;Okota Toshiyuki;Obayashi Yoshiaki   Patent Agency Code  72001 Patent Agent  yang kai AbstractThe invention is capable of increasing the… Read More »

Luminous compound semiconductor device and its preparing process

Application Number  00128644 Application Date  2000.09.18 Publication Number  1344035 Publication Date  2002.04.10 Priority Information     International Classification  H01L33/00;H01S5/00   Applicant(s) Name  Lianyong Science and Technology Co Ltd   Address     Inventor(s) Name  Lin Mingde   Patent Agency Code  11105 Patent Agent  tao fengbei AbstractA luminous compound semiconductor device has a laminated GaN-type semiconductor… Read More »

Semiconductor device and its mfg. method

Application Number  00128546 Application Date  2000.11.17 Publication Number  1297256 Publication Date  2001.05.30 Priority Information   1999/11/18 JP 327916/1999   International Classification  H01L27/12;H01L27/06;H01L21/824;H01L21/84   Applicant(s) Name  K.K. Toshiba   Address     Inventor(s) Name  Ushiku Yukihiro   Patent Agency Code  11038 Patent Agent  wang yonggang AbstractIn a semiconductor device having integrated semiconductor elements with a plurality… Read More »

Semiconductor storage device and its operation setting method

Application Number  00128507 Application Date  2000.09.20 Publication Number  1293408 Publication Date  2001.05.02 Priority Information   1999/9/20 JP 265448/99   International Classification  G06F13/00   Applicant(s) Name  Sony Corp.   Address     Inventor(s) Name  Inomura Shigeshi   Patent Agency Code  72001 Patent Agent  fu kang AbstractA mode setting means is provided for setting a mode, an… Read More »

Semiconductor device and forming method thereof

Application Number  00128363 Application Date  1993.06.09 Publication Number  1313640 Publication Date  2001.09.19 Priority Information   1992/6/9 JP 174883/92   International Classification  H01L27/01;H01L21/70   Applicant(s) Name  Semiconductor Energy Lab. Co., Ltd.   Address     Inventor(s) Name  Takemura Yasuhiko   Patent Agency Code  72001 Patent Agent  li efei AbstractIn a field effect type device having a… Read More »

Semiconductor device and its producing method

Application Number  00128327 Application Date  2000.11.24 Publication Number  1298207 Publication Date  2001.06.06 Priority Information   1999/11/25 JP 334978/1999   International Classification  H01L31/022;H01L31/04   Applicant(s) Name  Sony Corp.   Address     Inventor(s) Name  Machida Akio;Dallam. Parr. Gausel;Noguchi Takashi   Patent Agency Code  11038 Patent Agent  du rixin AbstractFor manufacturing a semiconductor device, such as thin-film… Read More »

Semiconductor storage medium

Application Number  00128317 Application Date  2000.11.15 Publication Number  1296223 Publication Date  2001.05.23 Priority Information   1999/11/15 JP 324444/99   International Classification  G06F12/00;H04N1/21   Applicant(s) Name  Sony Corp.   Address     Inventor(s) Name  Sawada Katsu   Patent Agency Code  11105 Patent Agent  ma ying AbstractThe picture signal picked up by a MOS sensor 2a in… Read More »

Probe unit for inspection of base board for assemblying semiconductor chip

Application Number: 00117650Application Date: 2000.05.26Publication Number: 1276530Publication Date: 2000.12.13Priority Information: 1999/5/27 JP 148729/1999International: G01R1/073;H01L21/66Applicant(s) Name: NHK Spring Co., Ltd.Address: Inventor(s) Name: Ishikawa Shigeki;Nanseki KenjiPatent Agency Code: 11038Patent Agent: wang yonggangAbstract The present invention is to prevent a damage to a contact probe unit when applying the unit to a based board carrying semiconductor chips due… Read More »

Method for producing semiconductor device

Application Number: 00120716Application Date: 2000.07.07Publication Number: 1280314Publication Date: 2001.01.17Priority Information: 1999/7/9 JP 196766/1999International: G03F1/08;H01L21/027;H01L21/30Applicant(s) Name: NEC Corp.Address: Inventor(s) Name: Fujimoto TadashiPatent Agency Code: 11021Patent Agent: rong zhiminAbstract A reticle is provided, which improves the alignment or stacking accuracy and reduces the error or incorrectness of alignment accuracy measurement using the alignment mark in the optical… Read More »

Manufacturing method of lead-wire frame and resin sealing type semiconductor device

Application Number: 00122860Application Date: 2000.08.30Publication Number: 1291789Publication Date: 2001.04.18Priority Information: 1999/9/1 JP 247530/1999International: H01L21/50;H01L23/495;H01L23/50Applicant(s) Name: Matsushita Electric Corp.Address: Inventor(s) Name: Kosuo Kyoiki;Adachi OsamuPatent Agency Code: 11021Patent Agent: wang huiminAbstract In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion.… Read More »

Capacitor for semiconductor storage device and its producing method

Application Number: 00126816Application Date: 2000.06.25Publication Number: 1287386Publication Date: 2001.03.14Priority Information: 1999/6/25 KR 24218/99; 1999/6/25 KR 24219/99International: H01L21/70;H01L27/04;H01L27/10Applicant(s) Name: Hyundai Electronics Industries Co., Ltd.Address: Inventor(s) Name: Lee Gichung;Hahn Igvn;Ryang HongsonPatent Agency Code: 11105Patent Agent: tao fengbeiAbstract A lower polysilicon capacitor dielectric is nitrided to prevent the generation of a natural oxide layer, a TaON dielectric layer… Read More »

Optical module and its manufacturing method, semiconductor device and optical transmission device

Application Number: 00118622Application Date: 2000.06.16Publication Number: 1293375Publication Date: 2001.05.02Priority Information: 2000/4/18 JP 116438/00; 1999/6/16 JP 169659/99International: G02B6/42Applicant(s) Name: Seiko Epson Corp.Address: Inventor(s) Name: Ichii Kazutoku;Umetsu Ichisei;Murata AkihiroPatent Agency Code: 72001Patent Agent: yang kaiAbstract An optical module comprising: an optical fiber; an optical element having an optical section and with a fixed position relative to the… Read More »

Wiring and its making method including the described wired semiconductor device and dry etching process

Application Number: 00121738Application Date: 2000.07.24Publication Number: 1282107Publication Date: 2001.01.31Priority Information: 1999/7/22 JP 206954/99International: H01L21/306;H01L29/786Applicant(s) Name: Semiconductor Energy Laboratory Co., Ltd.Address: Inventor(s) Name: Suzawa Hideomi;Onu KoyiPatent Agency Code: 72001Patent Agent: liang yongAbstract A dry etching method for forming tungsten wiring having a tapered shape and having a large specific selectivity with respect to a base film… Read More »

Capacitor of semiconductor storage element and its producing method

Application Number: 00124027Application Date: 2000.07.01Publication Number: 1280391Publication Date: 2001.01.17Priority Information: 1999/7/1 KR 26386/99International: H01L21/70;H01L27/04;H01L27/10Applicant(s) Name: Hyundai Electronic Industrial Co., Ltd.Address: Inventor(s) Name: Lee Kyvi-Chong;Kim Tong-JonPatent Agency Code: 11105Patent Agent: fan mengeAbstract PROBLEM TO BE SOLVED: To provide a capacitor of a semiconductor element provided with a dielectric film, wherein generation of a leakage current is… Read More »

Semiconductor structure having crystalline alkaline earth metal oxide interface with silicon

Application Number: 00120218Application Date: 2000.07.13Publication Number: 1334595Publication Date: 2002.02.06Priority Information: International: H01L21/00;H01L21/20;H01L29/04;H01L29/12Applicant(s) Name: Motorola Inc.Address: Inventor(s) Name: Wang Jun;W.J. Ums;J.A. HolmarkPatent Agency Code: 11038Patent Agent: fu jianjunAbstract A structure of semiconductor incldues silicon substrate, a layer or multi layers of monocrystal oxide. An boundary surface between the silicon substrate and the layer or multi layers… Read More »

Method for installing semiconductor chip

Application Number: 00122531Application Date: 2000.08.04Publication Number: 1320957Publication Date: 2001.11.07Priority Information: 2000/4/25 JP 124878/2000International: G11B5/00;H01L21/58Applicant(s) Name: Fujitsu Ltd.Address: Inventor(s) Name: Umaba Shunji;Yamaue Takatoyo;Uminuma TsuneoPatent Agency Code: 11038Patent Agent: ma gaoAbstract A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive… Read More »