Tag Archives: wiring

Multi-layer flexible wiring board and its production method

Application Number  00128197 Application Date  2000.10.17 Publication Number  1312671 Publication Date  2001.09.12 Priority Information   1999/10/18 JP 294686/99   International Classification  H05K3/46   Applicant(s) Name  Sony Chemical Corp.   Address     Inventor(s) Name  Kurita Hideyuki;Hishinuma Hiroyuki   Patent Agency Code  72001 Patent Agent  wang zhongzhong AbstractThe present invention is directed to perform ultrasonic bonding… Read More »

Flexible wiring base unit and wiring board

Application Number: 00120131Application Date: 2000.07.11Publication Number: 1280370Publication Date: 2001.01.17Priority Information: 1999/7/12 JP 197834/99International: G11B5/48;G11B21/16;H05K1/00Applicant(s) Name: Sony Chemical Corp.Address: Inventor(s) Name: Tsutsumi Akira;Kurita HideyukiPatent Agency Code: 72001Patent Agent: yang kaiAbstract The object of the present invention is to prevent short-circuit due to disturbance of a connection terminal and facilitate cutting from the intermediate connection terminal part,… Read More »

Wiring structure of solar battery assembly

Application Number: 00120994Application Date: 2000.08.08Publication Number: 1283873Publication Date: 2001.02.14Priority Information: 1999/8/9 JP 225822/99International: H01L31/05Applicant(s) Name: Fujisan Co., Ltd.Address: Inventor(s) Name: Itsuki Tatomomi;Kurosawa Suketsugu;Ishigaki ShikyoPatent Agency Code: 11216Patent Agent: liu jiyangAbstract The invention relates to a method of leading electric wires of solar cell module. A retaining section 3 is formed to a conductive section on… Read More »

Wiring and its making method including the described wired semiconductor device and dry etching process

Application Number: 00121738Application Date: 2000.07.24Publication Number: 1282107Publication Date: 2001.01.31Priority Information: 1999/7/22 JP 206954/99International: H01L21/306;H01L29/786Applicant(s) Name: Semiconductor Energy Laboratory Co., Ltd.Address: Inventor(s) Name: Suzawa Hideomi;Onu KoyiPatent Agency Code: 72001Patent Agent: liang yongAbstract A dry etching method for forming tungsten wiring having a tapered shape and having a large specific selectivity with respect to a base film… Read More »

Flexible wiring base plate, electrooptical apparatus and electronic apparatus

Application Number: 00126882Application Date: 2000.09.01Publication Number: 1287285Publication Date: 2001.03.14Priority Information: 1999/9/3 JP 249463/99International: G02F1/133;H05K3/36Applicant(s) Name: Seiko Epson Corp.Address: Inventor(s) Name: Koki KomeiPatent Agency Code: 72001Patent Agent: yang kaiAbstract A flexible wiring board 100 includes a first single-sided flexible board 10 and a second single-sided flexible board 20. The first single-sided flexible board 10 includes a… Read More »

Connector for printed wiring board

Application Number: 00109675Application Date: 2000.06.20Publication Number: 1282124Publication Date: 2001.01.31Priority Information: 1999/7/26 JP 210229/1999International: H01R13/658;H01R12/36Applicant(s) Name: Nippon Press Terminal Manufacture Co., Ltd.Address: Inventor(s) Name: Kuroda Keiji;Aramoto KiyoshiPatent Agency Code: 11021Patent Agent: huang yongkuiAbstract The present invention provides a connector (1) for printed circuit board, which comprises a connector body (8) having an insertion space (5) for… Read More »

Correction for metal inlaid wiring form

Application Number: 00108534Application Date: 2000.05.12Publication Number: 1274171Publication Date: 2000.11.22Priority Information: 1999/5/14 US 09/313564International: H01L21/302;H01L21/314;H01L21/768Applicant(s) Name: IBM Corp.Address: Inventor(s) Name: S. G. Bangbatill;E. J. WhitePatent Agency Code: 72001Patent Agent: liang yongAbstract A method and structure for planarizing a semiconductor surface having topographical irregularities including coating the semiconductor surface with a polish stop layer, depositing a filling… Read More »

Flexible printing wiring substrate, electrooptics arrangement, and electronic device

Application Number: 00108385Application Date: 2000.03.25Publication Number: 1268675Publication Date: 2000.10.04Priority Information: 2000/1/31 JP 21607/00; 2000/1/31 JP 22890/00; 1999/3/26 JP 84770/99International: G02F1/133Applicant(s) Name: Seiko Epson Corp.Address: Inventor(s) Name: Endo Koo;Oishi Eiji;Ariga YasutoPatent Agency Code: 72001Patent Agent: jiang fuhouAbstract Connection terminals connected to a scanning driver IC chip 32 are arranged on a short side of a wiring… Read More »

Standard unit, standard unit array and its layout and wiring system and method

Application Number: 00107876Application Date: 2000.06.28Publication Number: 1290964Publication Date: 2001.04.11Priority Information: 1999/6/28 JP 182445/1999International: H01L21/82;H01L27/00Applicant(s) Name: NEC Corp.Address: Inventor(s) Name: Furuzai AtsukoPatent Agency Code: 11219Patent Agent: mu dejunAbstract In a placement and routing for a standard cell type LSI design, each standard cell comprises a VDD power supply terminal formed of a P-type diffused layer, a… Read More »

Electronic device without wiring

Application Number: 00106220Application Date: 2000.04.27Publication Number: 1320956Publication Date: 2001.11.07Priority Information: International: H01L21/50;H05K3/30;H05K13/00Applicant(s) Name: Puluoqiangsheng Semiconductor Co., Ltd, BeijingAddress: Inventor(s) Name: Chen QingfengPatent Agency Code: 00000Patent Agent: Abstract An electronic device without wiring features that the opaque circuit chip or crystal grain is directly connected with PCB and then packed. For the crystal grain which is… Read More »

Insertion device based on wiring sector used for high frequency electric connection

Application Number: 00106025Application Date: 2000.04.13Publication Number: 1305247Publication Date: 2001.07.25Priority Information: 1999/12/9 US 09/457,776International: H01R12/22;H01R12/36;H01R13/24Applicant(s) Name: High-density Connector Co., Ltd.Address: Inventor(s) Name: Li Ze-Yu;Mart A. Kolholning;Shi Wei-minPatent Agency Code: 11240Patent Agent: zan meiqiAbstract An interposer for a land grid array includes a dielectric grid having an array of holes and a resilient, conductive button disposed in… Read More »

Connection wiring base board of electro-optical board, electro-optical device and electronic device

Application Number: 00102814Application Date: 2000.01.17Publication Number: 1263280Publication Date: 2000.08.16Priority Information: 1999/12/2 JP 343696/99; 1999/1/18 JP 9165/99International: G02F1/136Applicant(s) Name: Seiko Epson Corp.Address: Inventor(s) Name: Ariga YasutoPatent Agency Code: 72001Patent Agent: jiang fuhouAbstract A wiring board (flexible wiring board) 400 for connection of an electro-optical panel is connected to an electro-optical panel (liquid crystal panel) 100 having… Read More »

Cable wiring connector

Application Number: 00100840Application Date: 2000.02.15Publication Number: 1264193Publication Date: 2000.08.23Priority Information: 1999/2/16 JP 037789/99; 1999/2/16 JP 037792/99International: H01R11/00;H01R13/00;H01R13/422Applicant(s) Name: Sumitomo Wiring System Ltd.Address: Inventor(s) Name: Shinosaki TetsuyaPatent Agency Code: 11219Patent Agent: zhu deheAbstract To provide a joint connector having an excellent operability. There are two engaged states of a female connector housing 20 and a joint… Read More »

Wiring board and cable management support frame integrated component and its production method

Application Number: 00100826Application Date: 2000.01.14Publication Number: 1263222Publication Date: 2000.08.16Priority Information: 1999/1/14 EP 99300216.1; 2000/1/12 US 09/481,631International: F16L3/00Applicant(s) Name: Thomas & Betts International Co., Ltd.Address: Inventor(s) Name: Partrick A. J. JabaPatent Agency Code: 31100Patent Agent: wu menghuaAbstract An integral one-piece patch panel and cable management tray assembly formed from a single sheet of material comprising a… Read More »

Flexible wiring base and making method thereof

Application Number: 00100756Application Date: 2000.02.03Publication Number: 1264270Publication Date: 2000.08.23Priority Information: 1999/2/3 JP 25911/1999; 1999/12/7 JP 347524/199International: H05K3/00;H01L23/50;H01L21/60Applicant(s) Name: Casio Computer Co., Ltd.Address: Inventor(s) Name: Saito KoichiPatent Agency Code: 72002Patent Agent: han hongAbstract Predetermined wiring of copper is formed on the upper surface of an elongated base film in a wiring forming area as a width-directional… Read More »