Technological process of making printed circuit board


Application Number: 00117305
Application Date: 2000.07.26
Publication Number: 1335743
Publication Date: 2002.02.13
Priority Information:
International: H05K3/16;H05K3/46
Applicant(s) Name: Zhao Yuantao
Address:
Inventor(s) Name: Zhao Yuantao
Patent Agency Code: 44209
Patent Agent: wang zhimeng
Abstract The technological process of making printed circuit board includes: coating or adhering one layer of photosensitive material onto one insulating substrate; exposure and development to obtain the negative of the printed circuit; vacuum magnetically controlled sputtering to deposit copper on the surface of the substrate; and washing to eliminate partial photosensitive material and copper foil to obtain printed circuit. During the process, conducting metal layer with high adhesion may be formed into all through holes. Without chemical reaction, the simple process of the present invention can produce printed circuit and metallized holes, that is, complete the key course of producing printed circuit board.