Technology for laminating 6-layer circuit board suitable for high-speed signals and its product

Application Number  00128837 Application Date  2000.09.18
Publication Number  1344132 Publication Date  2002.04.10
Priority Information    
Applicant(s) Name  Shenda Computer Co Ltd  
Inventor(s) Name  Chen Ronggui  
Patent Agency Code  31100 Patent Agent  wu rongjun
AbstractA 6-layer printed circuit board for high-speed signals features that the first insulating layer is between the third and fourth layers, the second insulating layer is between the second and third layers and between the fourth and fifth layers, the third insulating layer is between the first and second layers and between the fifth and sixth layers, the first and third layers are signal layers, the second layer is grounding layer and among the fourth, fifth and sixth layers one of adjacent layers is power supply layer and another is grounding layer.