Terminal structure for high-speed high-pin density chip

Application Number: 00107027
Application Date: 2000.02.22
Publication Number: 1310515
Publication Date: 2001.08.29
Priority Information:
International: H03K19/003;H03K17/16;H03F1/26
Applicant(s) Name: Lucent Technologies Inc.
Address:
Inventor(s) Name: Cao Xianguo
Patent Agency Code: 11038
Patent Agent: wang yonggang
Abstract A terminal structure of high base pin density chip in high speed includes the first component, the second component, at least one connection piece between the input end of the second component and the output end of the first component, at least one resistance in series connection between at least input end of the second component and the connection piece. The structure reduced the impulse disturbance and ring bell of high density seal packed input end of the target high speed or after the input base pin seal packed as well as the overpulse and down pulse are also reduced. The establishing process of logical electric level of the input signal with be finished more fast and more stable. The series connecting resistance will consume vary little extra power.

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