Built-in card for integrated circuit

Application Number: 00109772
Application Date: 2000.07.06
Publication Number: 1287336
Publication Date: 2001.03.14
Priority Information: 1999/7/6 JP 192152/1999
International: G06K19/07
Applicant(s) Name: Nippon Press Terminal Manufacturing Co., Ltd.
Address:
Inventor(s) Name: Washino Kiyoshi;Shohara Yoshitaka
Patent Agency Code: 11021
Patent Agent: huang yongkui
Abstract An IC-incorporating card has a grounding structure which ensures reliable grounding of metal panels thereof and employs a connector which is usable in common for cards having different thicknesses. The card includes a board mounted with an integrated circuit, a resin frame defining an internal space for accommodating the board, first and second metal panels attached to the resin frame to define the internal space, a connector mounted on the board, and a grounding structure for grounding the first and second metal panels. The connector has first and second grounding conductor elements. The first metal panel is connected to the first grounding conductor element via a grounding connection element embedded in the resin frame. The second metal panel is directly connected to the second grounding conductor element.