Circuit board assembly

Application Number: 00102642
Application Date: 2000.02.24
Publication Number: 1264947
Publication Date: 2000.08.30
Priority Information: 1999/2/24 JP 046194/99
International: H02G3/16
Applicant(s) Name: Sumitomo Wiring System, Ltd.
Inventor(s) Name: Kobayashi Seisame
Patent Agency Code: 11105
Patent Agent: li xiaoshu
Abstract A circuit board assembly including an insulative substrate and a busbar located on the upper surface thereof. There is at least one cavity in the substrate with a boss projecting therefrom. An expanded section of the boss is provided adjacent the bottom of the cavity and the busbar has an insertion opening, corresponding to the shape of the boss, through which the boss projects. The boss is adapted to be pressed toward the expanded portion so as to overlie a part of the substrate, thereby fixing the busbar thereto. This configuration permits the assembly to be made smaller, with attendant savings in production costs and improvements in ease of production.