Connecting materials

Application Number  00128412 Application Date  2000.09.14
Publication Number  1294166 Publication Date  2001.05.09
Priority Information   1999/9/14 JP 261095/99  
Applicant(s) Name  Sony Chemicals Co., Ltd.  
Inventor(s) Name  Takeichi Genshu;Yagi Hidekazu;Suemasa Kaorusato  
Patent Agency Code  72001 Patent Agent  pang lizhi
AbstractA connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements and in building up electroconductive connection between the corresponding electrodes and can provide mechanical bonding and electrical connection effectively even when bonding an element of a polyimide resin film with a counter element, without the occurrence of a reduction in the reliability of the electrical conductance, even in services under a high temperature and high humidity. The connecting material contains an adhesive component containing a thermosetting resin and has, after having been cured, characteristic features of a modulus of elasticity at 30 DEG C in the range of 0.9-3 Gpa, a glass transition temperature of at the lowest 100 DEG C and a tensile elongation percentage of at least 3%.