Application Number: 00102599
Application Date: 2000.04.03
Publication Number: 1269604
Publication Date: 2000.10.11
Priority Information: 1995/4/27 FR 9505015
International: H01B1/02;H01L21/60;H01L23/48
Applicant(s) Name: Anphy Corp.
Address:
Inventor(s) Name: R. Keza;J. P. Rayar
Patent Agency Code: 11038
Patent Agent: long chuangong
Abstract An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.