Full-integrated hot ink-jet print head having plurality of inking holes per jet port

Application Number: 00108729
Application Date: 2000.05.26
Publication Number: 1286169
Publication Date: 2001.03.07
Priority Information: 1999/8/27 US 09/384849
International: B41J2/14
Applicant(s) Name: Hewlett-Packarad Co.
Inventor(s) Name: N.A. Kavamura;C.C. Davies;T.L. Weber
Patent Agency Code: 72001
Patent Agent: cai minjun
Abstract Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers (24, 40-50), including ink ejection elements (24, 62), are formed on a top surface of a silicon substrate (20). The various layers are etched to provide conductive leads (25) to the ink ejection elements (24, 62). At least one ink feed hole (26, 66, 67) is formed through the thin film layers for each ink ejection chamber (30). A trench (36) is etched in the bottom surface of the substrate (20) so that ink (38) can flow into the trench. An orifice layer (28) is formed on the top surface of the thin film layers to define the nozzles (34) and ink ejection chambers (24, 62).