Low-poison urea-formaldehyde resin adhesive and its preparing process

Application Number: 00124884
Application Date: 2000.09.21
Publication Number: 1291632
Publication Date: 2001.04.18
Priority Information:
International: C09J103/20;C09J161/06
Applicant(s) Name: He Weiping
Inventor(s) Name: Sun Xiaomo;Feng Haiqiang
Patent Agency Code: 00000
Patent Agent:
Abstract A low-poison urea-formaldehyde resin adhesive is prepared from urea, formaldehyde, cyanuramide, phenolic resin and oxidized starch, and features low content of free formaldehyde, resulting in low environmental pollution.