Magnetic head assembly with IC core arranged on floatation part of mangetic disc by ultrasonic welding process

Application Number: 00108119
Application Date: 2000.04.28
Publication Number: 1279464
Publication Date: 2001.01.10
Priority Information: 1999/7/2 JP 189281/1999; 1999/10/25 JP 303062/199
International: G11B5/127;H01L21/607
Applicant(s) Name: Fujitsu Ltd.
Inventor(s) Name: Umaka Shuni;Kitsuryo Hidehiko;Uminuma Tsuneo
Patent Agency Code: 11038
Patent Agent: zhang zhaodong
Abstract A suspension of a head assembly provided in a disk apparatus is prevented from being deformed due to mounting of a head IC chip onto the suspension. The head IC chip mounted on the suspension has protruding electrodes made of gold. The suspension has electrode pads connected to the respective protruding electrodes of the head IC chip. Each of the electrode pads has a surface layer made of gold. The protruding electrodes of the head IC chip are bonded to the electrode pads of the suspension by ultrasonic bonding.