Manufacture of cladded hollow megnetron sputtering target


Application Number: 00109853
Application Date: 2000.07.10
Publication Number: 1308146
Publication Date: 2001.08.15
Priority Information: 1999/8/3 US 09/368062
International: C23C14/35;H01J9/02;H01J23/05
Applicant(s) Name: Polex Ea ST Tech. Inc.
Address:
Inventor(s) Name: Shaileshi Kurcani;Tony Sica;Remond K.F. Ramo
Patent Agency Code: 72002
Patent Agent: liu xinpeng
Abstract A method is provided for forming clad hollow cathode magnetron sputter targets that are lighter in weight and/or less expensive than monolithic targets. A plate of sputter target material is bonded to a sheet of cladding material that is lighter in weight and/or less expensive than the sputter target material. This clad target assembly is then formed into a hollow cathode magnetron sputter target, such as by deep drawing. The clad hollow cathode magnetron further provides greater percent utilization of sputter target material than monolithic targets.