Method for producing electronic element

Application Number  00129586 Application Date  2000.10.08
Publication Number  1290946 Publication Date  2001.04.11
Priority Information   1999/10/4 JP 282609/1999  
Applicant(s) Name  Murata Manufacturing Co., Ltd.  
Inventor(s) Name  Masuda Fumitoshi  
Patent Agency Code  11021 Patent Agent  huang yongkui
AbstractThis invention provides a manufacturing method of an electronic component, which can exclude or cut down jigs for alignment and realize reduction in manufacturing cost and improvement of working efficiency. After a substrate is fixed to terminals coupled with a lead frame, it is set in a built-in mold, and a case is so set in the built-in mold that a bottom part aperture faces the substrate. By operating the built-in mold from the direction opposite to the case, a coupling part between the lead frame and the terminals is cut, and the substrate is made to engage with the bottom part aperture of the case. The case is pushed out in the direction opposite to the cutting direction, and the outer side surface of the case is held temporarily with anchoring pawls of the lead frame. After the lead frame holding the case is temporarily taken out from the built-in mold, the bottom part aperture of the case is filled with a sealing resin and it is hardened in a sealing process. After that, the case is isolated from the lead frame.