Package for electronic component

Application Number: 00108651
Application Date: 2000.05.08
Publication Number: 1273457
Publication Date: 2000.11.15
Priority Information: 1999/5/6 JP 126050/99
International: H01L23/498
Applicant(s) Name: Murata Manufacturing Co., Ltd.
Inventor(s) Name: Shimoe Ichishin
Patent Agency Code: 31100
Patent Agent: shen zhaokun
Abstract A package for electronic components includes a base substrate having at least one recess on a side surface thereof, the base substrate having electrodes on an upper surface and a bottom surface thereof and a conductive pattern arranged in the recess such that the electrode on the upper surface is electrically connected to the electrode on the bottom surface through the conductive pattern. A side wall of the package has a through-hole which provides a space for receiving an electronic element. The side wall has at least one recess on a side surface thereof and is provided on the base substrate such that the recess of the side wall is connected to the recess of the base substrate so as to provide a communicating recess. The recess of the base substrate has a cross-sectional area that is substantially larger than the recess of the side wall in a direction that is substantially perpendicular to the base substrate.