PC board capable of preventing short circuit during welding

Application Number: 00102917
Application Date: 2000.03.09
Publication Number: 1267182
Publication Date: 2000.09.20
Priority Information: 1999/3/13 KR 08509/1999
International: H05K3/34
Applicant(s) Name: Samsung Electronics Co., Ltd.
Inventor(s) Name: Lee Seung-Mo;Chong Myong-Hwa
Patent Agency Code: 11219
Patent Agent: xie lina
Abstract The present invention relates to a printed circuit board capable of preventing electrical short during a soldering process. A printed circuit board containing pin-through holes, comprises components for mounting on the printed circuit board to be electrically connected with the printed circuit board, wherein each of the components includes a plurality of pins for inserting into the pin-through holes, patterns formed on the printed circuit board, wherein the patterns are located adjacent to a last one hole among the arranged pin-through holes, and at least one zone formed on at least one of the patterns, wherein a surface of the at least one zone is capable of being soldered, and wherein the at least one zone is formed on the same line passing through the plurality of pins and to absorb an excess amount of the solder at the last one hole, which prevents an electrical short due to the excess solidification of the solder at the last solder.