Semiconductor device

Application Number: 00108145
Application Date: 2000.04.29
Publication Number: 1285620
Publication Date: 2001.02.28
Priority Information: 1999/8/23 JP 235115/99
International: H01L27/00
Applicant(s) Name: Mitsubishi Electric Corp.
Inventor(s) Name: Sakita Hiroyoshi
Patent Agency Code: 72001
Patent Agent: yang kai
Abstract A semiconductor device is provided to effectively use the rear surface of a semiconductor chip where no semiconductor circuit is formed. The semiconductor device(IC) is equipped with a semiconductor circuit(2), formed on the one surface (semiconductor chip surface) of a semiconductor chip(1), where a circuit element such as a capacitor, a resistor or a coil and pads(6 and 7) connected to the circuit element are formed through vapor growth method (CVD), sputtering method, electrolytic plating method or the like on the rear surface(4) of the semiconductor chip(1), where the semiconductor circuit(2) is not formed. A coil element(8) or the like, which is comparatively large in area, can be provided on the rear surface of a semiconductor chip.