Surface mounted electronic parts and its mfg. method

Application Number  00128439 Application Date  2000.11.20
Publication Number  1311562 Publication Date  2001.09.05
Priority Information   1999/11/18 JP 328108/99  
Applicant(s) Name  Murata Manufacturing Co., Ltd.  
Inventor(s) Name  Waza Masaya  
Patent Agency Code  31100 Patent Agent  shen zhaokun
AbstractA surface mounting electronic component with external electrodes has a structure in which plated coatings are laminated on metallic coatings by a wet barrel plating method, so as to achieve reduced variation in thickness of the plated coatings of the plurality of external electrodes and reduced defective component frequency rate, with the result that materials for the plated coatings can be utilized efficiently. A plurality of external electrodes are disposed on the outer surfaces of an electronic component body. Each of the external electrodes includes metallic coatings and plated coatings disposed on the metallic coatings by a wet plating method. The area of each of the plurality of electrodes is approximately the same, and the total of lengths of each of the external electrodes on the edges of the electronic component body is approximately the same.