Pressure-sensitive adhesive agent with improved stripping strength and adhesiveness

Application Number: 00122693Application Date: 2000.08.16Publication Number: 1285380Publication Date: 2001.02.28Priority Information: 1999/8/23 US 60/150,247International: C09J7/02;C09J133/02;C09J133/04;C08F2/22;C08F4/00Applicant(s) Name: Rohm and Haas Co.Address: Inventor(s) Name: P.M. Leiske;R.M. BrankensipPatent Agency Code: 11038Patent Agent: chen jizhuangAbstract An aqueous composition suitable for use when dry as a pressure sensitive adhesive including an aqueous emulsion polymer formed by the free radical polymerization of Read more

Ethylene-ethenol copolymer constituted resin composition with good adhesiveness between layers

Application Number: 00124056Application Date: 2000.07.07Publication Number: 1281004Publication Date: 2001.01.24Priority Information: 1999/7/7 JP 192844/99; 1999/9/7 JP 253516/99International: C08L23/08;C08L29/04Applicant(s) Name: Kuraray Co., Ltd.Address: Inventor(s) Name: Shintome Hiroyuki;Ino NaokiyoPatent Agency Code: 72001Patent Agent: wei jinxiAbstract Disclosed are a resin composition comprising an ethylene-vinyl alcohol copolymer and a multi-layered structure comprising the resin composition. The resin composition has extremely Read more

Upside down mounting chip package with optimization adhesiveness of sealant and producing method thereof

Application Number: 00104301Application Date: 2000.03.16Publication Number: 1267908Publication Date: 2000.09.27Priority Information: 1999/3/19 US 09/272518International: H01L21/312;H01L21/50Applicant(s) Name: International Business Machine Corp.Address: Inventor(s) Name: R. R. Codnerny;L. J. Matinso;S. K. TerlanPatent Agency Code: 72001Patent Agent: liang yongAbstract An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation Read more