Tag Archives: Full-integrated

Full-integrated hot ink-jet print head having plurality of inking holes per jet port

Application Number: 00108729Application Date: 2000.05.26Publication Number: 1286169Publication Date: 2001.03.07Priority Information: 1999/8/27 US 09/384849International: B41J2/14Applicant(s) Name: Hewlett-Packarad Co.Address: Inventor(s) Name: N.A. Kavamura;C.C. Davies;T.L. WeberPatent Agency Code: 72001Patent Agent: cai minjunAbstract Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers (24, 40-50), including ink ejection elements (24, 62), are formed on a… Read More »

Full-integrated hot ink-jet print head having silicophosphate glass layer with etched back

Application Number: 00108727Application Date: 2000.05.26Publication Number: 1286168Publication Date: 2001.03.07Priority Information: 1999/8/27 US 09/384814International: B41J2/14Applicant(s) Name: Hewlett-packarad Co.Address: Inventor(s) Name: N.A. Kavamura;C.C. Davies;T.L. WeberPatent Agency Code: 72001Patent Agent: cai minjunAbstract Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers (24, 40-50), including ink ejection elements (24), are formed on a top… Read More »

Full-integrated hot ink-jet print head with laminated film

Application Number: 00108717Application Date: 2000.05.26Publication Number: 1286167Publication Date: 2001.03.07Priority Information: 1999/8/27 US 09/384817International: B41J2/14Applicant(s) Name: Hewlett-Packarad Co.Address: Inventor(s) Name: N.A. Kavamura;C.C. Davies;T.L. WeberPatent Agency Code: 72001Patent Agent: cai minjunAbstract Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers (24, 40-50), including ink ejection elements (24), are formed on a top… Read More »