Tag Archives: silicon/epoxy

Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide

Application Number: 00108814Application Date: 2000.05.10Publication Number: 1270979Publication Date: 2000.10.25Priority Information: International: C08K9/02;C08L63/00;C09K3/10Applicant(s) Name: Jilin Univ.Address: Inventor(s) Name: Fang Kun;Zhao Yi;Huang JinsongPatent Agency Code: 22201Patent Agent: zhang jinglinAbstract The present invention relates to a room temperature cured single-component organic silicon/epoxy resin encapsulating material after being activization-treated and modified with nanometer SiO2-x. The said encapsulating material contains… Read More »